Sigrity PowerDC
确保供电可靠
核心优势
To ensure you achieve reliable power delivery, Cadence® Sigrity™ PowerDC™ technology provides efficient DC analysis for signoff of IC package and PCB designs, including electrical/thermal co-simulation to maximize accuracy. PowerDC technology quickly pinpoints excessive IR drop, along with areas of excess current density and thermal hotspots to minimize your design’s risk of field failure.
为确保您获得可靠的供电,Cadence® Sigrity™ PowerDC™技术可为IC封装和PCB设计签收提供高效的包含电/热协同仿真在内的直流分析,最大限度地提高设计精准度。PowerDC技术可快速查明压降过大、电流过密、和温度过高的区域,最大限度地降低设计的现场故障风险。
直流分析显示了PCB各层的压降情况
主要功能